Cross section analysis is a critical method in printed circuit board (PCB) manufacturing and quality assurance. It allows engineers and technicians to examine internal PCB structures, validate product reliability, and detect process-related defects that cannot be seen from the outside. This 2-day hands-on program equips participants with the knowledge and skills to prepare, polish, and analyze PCB cross sections using microscopy. Through structured modules and practical exercises, participants will learn how to detect common PCB failures, perform thickness measurements, and prepare professional reports aligned with IPC standards. By the end of the course, participants will be capable of independently conducting cross section analysis to support defect identification, root cause investigations, and process improvements. This HRD Corp (HRDC) Claimable Course (Previously Known as SBL-Khas) Is Delivered by a Penang-Based Training Provider Registered with HRD Corp (Formerly Known as HRDF), Specializing in Corporate Skills Development and Workforce Upskilling Across Malaysia. 100% HRD Corp Claimable | Penang Training Provider | Corporate Training Malaysia
DAY 1
Fundamentals & Sample Preparation
Welcome & Introduction
• Training objectives, expectations, and importance of cross-section analysis in PCB manufacturing
• Applications: reliability validation, failure analysis, process control
Module 1: Basics of PCB & Failure Mechanisms
PCB structure & materials (substrates, copper, plating, solder mask)
Common defects: voids, delamination, cracks, plating issues, intermetallics
Industry standards (IPC-TM-650, IPC-A-600, IPC-6012)
Hands-on Activity:
Defect Identification Game: Participants review sample images of PCB defects and classify them by type.
Module 2: Cross Section Analysis Overview
Purpose of cross sectioning
Key equipment: cutting tools, mounting presses, grinders, polishers, microscopes
Safety practices in lab handling
Hands-on Activity:
Lab Familiarization: Trainer demonstrates tools & equipment for sample prep.
Participants handle dummy samples (non-functional PCBs) to understand tools.
Lunch
Module 3: Sample Cutting & Mounting
Selecting the right PCB area for analysis
Precision cutting techniques
Mounting samples in epoxy for stability
Avoiding sample damage
Hands-on Activity:
Participants cut and mount a PCB coupon section under supervision.
Module 4: Grinding & Polishing Techniques
Stepwise grinding (coarse → fine grit)
Polishing for metallographic analysis
Common errors in preparation (rounding edges, smearing, over-polishing)
Hands-on Activity:
Participants perform grinding & polishing on mounted PCB samples.
DAY 2
Module 5: Microscopy Techniques
Optical Microscopy vs SEM (Scanning Electron Microscopy)
Lighting & magnification for PCB inspection
Image capturing & documentation best practices
Hands-on Activity:
Participants use a microscope to examine their prepared cross-section samples.
Capture images of at least 3 features (via-out, copper plating, solder joints).
Module 6: Analysis of PCB Layers & Features
Layer thickness measurement (copper, plating, solder mask)
Plated through-hole (PTH) quality inspection
Identifying microvoids, cracks, delamination, resin recession, barrel cracking
Hands-on Activity:
Measure layer thickness on samples using microscope software.
Compare results with IPC standards.
Lunch
Module 7: Failure Analysis Using Cross Section
Identifying manufacturing defects vs service-related failures
Case studies:
PTH barrel cracks from thermal stress
Copper plating voids due to poor electroplating
Delamination due to moisture absorption
Hands-on Activity:
Participants analyze case-study samples/images and prepare a defect classification sheet.
Module 8: Reporting & Documentation
Writing cross-section analysis reports
Linking findings to root cause analysis
Recommendations for process improvements (plating, lamination, drilling, soldering)
Hands-on Activity:
Participants prepare a mini cross-section analysis report with images
from their samples.
Wrap-Up & Action Planning
